https://blog.wongcw.com/2021/08/03/intel%e3%80%81amd%e3%80%81%e5%8f%b0%e7%a9%8d%e9%9b%bb%ef%bc%9a%e9%83%bd%e7%9b%af%e4%b8%8a%e4%ba%862-5d%e3%80%813d%e5%b0%81%e8%a3%9d/
Intel、AMD、台積電:都盯上了2.5D、3D封裝