https://blog.wongcw.com/2021/07/20/ime%e7%aa%81%e7%a0%b4%e5%9b%9b%e5%b1%a43d%e5%a0%86%e7%96%8a%e6%8a%80%e8%a1%93%ef%bc%8c-%e6%9c%aa%e4%be%86%e8%8a%af%e7%89%87%e6%88%96%e8%a8%b1%e5%b0%b1%e5%83%8f%e4%b8%89%e6%98%8e%e6%b2%bb/
IME突破四層3D堆疊技術, 未來芯片或許就像三明治