https://blog.wongcw.com/2019/10/07/%e4%b8%89%e6%98%9f%e7%8e%87%e5%85%88%e9%96%8b%e7%99%bc%e5%87%ba12%e5%b1%a43d%e7%9f%bd%e7%a9%bf%e5%ad%94%e5%a0%86%e7%96%8a%ef%bc%9ahbm%e5%ad%98%e5%84%b2%e8%8a%af%e7%89%87%e5%ae%b9%e9%87%8f%e6%8f%90/
三星率先開發出12層3D矽穿孔堆疊:HBM存儲芯片容量提至24GB